Advancements in AI and Iot for Chip Manufacturing and Defect Prevention

Jain, Rupal

Advancements in AI and Iot for Chip Manufacturing and Defect Prevention
  • 出版商: Charles River Media
  • 出版日期: 2024-11-25
  • 售價: $3,400
  • 貴賓價: 9.5 折 $3,230
  • 語言: 英文
  • 頁數: 138
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 8770046816
  • ISBN-13: 9788770046817
  • 相關分類: 人工智慧、物聯網 IoT

    • 尚未上市，無法訂購

相關主題

商品描述

This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand the significance of defect prevention, and explore methods for optimizing processes by reducing defects using AI and IoT technologies.

In the dynamic landscape of semiconductor manufacturing, the focus on processes and defect prevention stands paramount. Traditional approaches have yielded valuable insights, yet the emergence of Artificial Intelligence (AI) and Internet of Things (IoT) technologies heralds a new era in defect prevention strategies. Engineers specializing in AI and machine learning, interdisciplinary researchers, and early graduates aspiring to enter the semiconductor industry will also find this book invaluable.

Meticulously crafted, this book provides concise, yet insightful content tailored to today's fast-paced readers. It emphasizes semiconductors, manufacturing processes, and defect prevention, offering a comprehensive understanding of these critical areas. The integration of AI and IoT in chip manufacturing defect prevention represents a groundbreaking advancement.

Targeting semiconductor engineers, researchers, technology professionals, and students, this book serves as a valuable resource for understanding the interplay between semiconductors, manufacturing processes, defects, and the transformative potential of AI and IoT integration. Practical tools for failure analysis and parameter control are provided, along with hypothetical use cases and theoretical applications that inspire innovation. Through interdisciplinary insights, this book charts a course toward a future where semiconductor manufacturing defects are minimized, productivity is maximized, and innovation thrives at the intersection of technology and industry.

商品描述(中文翻譯)

這本書是半導體專業人士擴展對矽製程知識的必讀之作，幫助他們理解缺陷預防的重要性，並探索利用人工智慧（AI）和物聯網（IoT）技術來優化製程、減少缺陷的方法。

在半導體製造的動態環境中，對製程和缺陷預防的重視至關重要。傳統方法雖然提供了寶貴的見解，但人工智慧（AI）和物聯網（IoT）技術的出現預示著缺陷預防策略的新時代。專注於AI和機器學習的工程師、跨學科研究者以及希望進入半導體行業的應屆畢業生，將會發現這本書的價值無可估量。

這本書經過精心編寫，提供簡潔而深刻的內容，適合當今快節奏的讀者。它強調半導體、製造過程和缺陷預防，提供對這些關鍵領域的全面理解。AI和IoT在晶片製造缺陷預防中的整合代表了一項突破性的進展。

本書針對半導體工程師、研究人員、技術專業人士和學生，作為理解半導體、製造過程、缺陷以及AI和IoT整合的變革潛力之間相互作用的寶貴資源。書中提供了故障分析和參數控制的實用工具，並附有假設性使用案例和理論應用，激發創新。透過跨學科的見解，本書為未來的半導體製造缺陷最小化、生產力最大化以及技術與產業交匯處的創新繁榮指引了方向。

作者簡介

Rupal Jain is a distinguished figure in the field of semiconductor chip manufacturing, with extensive expertise in engineering, program management, and strategic alignment. Throughout her career, she has spearheaded projects encompassing the entire chip development lifecycle - from design conception and quality management to global delivery across regions like the USA, Taiwan, Singapore, Italy, Malaysia, China, and India. Her profound knowledge is recognized by prestigious certifications like PMP, CSM, and Lean Six Sigma Black Belt. Rupal holds a master's degree in electrical and Electronics Engineering, earned through a joint program between NTU Singapore and TUM Germany. Beyond her technical prowess, Rupal's innovative contributions have garnered international acclaim. She is a frequent contributor to esteemed publications, serves on prestigious juries, and holds nominated memberships in industry organizations. Notably, her work has been recognized with coveted awards and patents, further solidifying her position as a leader in the field. Her other authored pieces- ""Mastering Project Management: PMP and Agile for Leaders"" and ""Semiconductor Essentials: A Leader's Express reference to Electronics Concepts"" promise to share her valuable insights with the next generation of leaders and engineers.

作者簡介(中文翻譯)

Rupal Jain 是半導體晶片製造領域的傑出人物，擁有豐富的工程、專案管理和策略對齊專業知識。在她的職業生涯中，她主導了涵蓋整個晶片開發生命周期的專案——從設計構思和品質管理到在美國、台灣、新加坡、義大利、馬來西亞、中國和印度等地的全球交付。她的深厚知識獲得了 PMP、CSM 和 Lean Six Sigma Black Belt 等權威認證的認可。Rupal 擁有電機與電子工程碩士學位，該學位是通過新加坡南洋理工大學和德國慕尼黑工業大學的聯合計畫獲得的。除了她的技術專長，Rupal 的創新貢獻也獲得了國際讚譽。她經常為知名出版物撰稿，擔任著名評審委員會成員，並在行業組織中擔任提名會員。值得注意的是，她的工作獲得了珍貴的獎項和專利，進一步鞏固了她在該領域的領導地位。她的其他著作《Mastering Project Management: PMP and Agile for Leaders》和《Semiconductor Essentials: A Leader's Express reference to Electronics Concepts》承諾將與下一代領導者和工程師分享她寶貴的見解。

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