Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Hardcover)

Kröhnert, Steffen, Keser, Beth

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Hardcover)
  • 出版商: Wiley
  • 出版日期: 2021-12-29
  • 售價: $1,750
  • 貴賓價: 9.8 折 $1,715
  • 語言: 英文
  • 頁數: 320
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119793777
  • ISBN-13: 9781119793779
  • 相關分類: 嵌入式系統

    • 立即出貨 (庫存=1)

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商品描述

This book provides an in-depth understanding of the various fan-out and embedded die approaches given by authors offering differing perspectives. It begins by benchmarking the latest application space, then moves on to a market forecast that attempts to reverse engineer the products that will be available. The book also provides an analysis of the IP landscape and cost comparison of new and existing technologies. It then describes solutions developed and offered by Semiconductor IDM companies driving new package types for advanced application space (e.g. Intel, NXP, Samsung). The book addresses the semiconductor needs of various foundries and manufacturers, and concludes by exploring cutting edge research ongoing at institutes and consortiums.

商品描述(中文翻譯)

本書提供了對不同觀點的作者所提供的各種扇出和嵌入式晶片方法的深入理解。它首先對最新的應用領域進行基準測試，然後進行市場預測，試圖逆向工程可用的產品。本書還提供了對知識產權風景和新舊技術成本比較的分析。然後，它描述了由半導體IDM公司開發和提供的針對先進應用領域的新封裝類型的解決方案（例如Intel、NXP、Samsung）。本書涵蓋了各種晶圓廠和製造商的半導體需求，最後探討了正在研究中的學院和聯盟的尖端研究。

作者簡介

Beth Keser, PhD, is an IEEE Fellow and Distinguished Lecturer with over 23 years' experience in the semiconductor industry and a co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Beth's excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 30 patents and patents pending and over 50 publications in the semiconductor industry.

Steffen Kröhnert is President & Founder of ESPAT-Consulting in Dresden, Germany. He is member of IEE EPS and co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Steffen has over 20 years' experience in the semiconductor industry and is the author or co-author of 23 patent filings.

作者簡介(中文翻譯)

Beth Keser博士是IEEE院士和傑出講師，擁有超過23年的半導體行業經驗，並且是《嵌入式和扇出晶圓級封裝技術進展》的共同編輯。Beth在開發半導體器件的革命性電子封裝方面表現出色，擁有30項專利和專利申請以及在半導體行業發表了50多篇論文。

Steffen Kröhnert是德國德累斯頓ESPAT-Consulting的總裁和創始人。他是IEEE EPS的成員，也是《嵌入式和扇出晶圓級封裝技術進展》的共同編輯。Steffen在半導體行業擁有超過20年的經驗，是23項專利申請的作者或共同作者。

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