Chiplet Design and Heterogeneous Integration Packaging
暫譯: 晶片小塊設計與異質整合封裝

Lau, John H.

Chiplet Design and Heterogeneous Integration Packaging
  • 出版商: Springer
  • 出版日期: 2023-03-28
  • 售價: $6,660
  • 貴賓價: 9.5 折 $6,327
  • 語言: 英文
  • 頁數: 525
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 9811999163
  • ISBN-13: 9789811999161
  • 相關翻譯: 芯粒設計與異質集成封裝 (簡中版)

    • 海外代購書籍(需單獨結帳)

相關主題

商品描述

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

商品描述(中文翻譯)

本書專注於晶片設計與異質整合封裝的設計、材料、流程、製造及可靠性。書中涵蓋了原則與工程實務，並更重視工程實務。這是透過對多個主要主題的深入研究來實現的，例如晶片劃分、晶片切割、使用 TSV 中介層的多系統與異質整合、使用無 TSV 中介層的多系統與異質整合、晶片之間的橫向通信、系統封裝、扇出晶圓/面板級封裝，以及各種銅-銅混合鍵合。本書對於電機工程、機械工程、材料科學及工業工程等領域的研究人員、工程師及研究生均有助益。

作者簡介

For Internal Use Only:

John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

作者簡介(中文翻譯)

僅供內部使用：
**John H Lau**，博士，專業工程師，IEEE 會士，ASME 會士，IMAPS 會士
Unimicron Technology Corporation，John_Lau@unimicron.com

**專業能力**
[1] 設計、分析、材料、工藝、製造、驗證、可靠性、測試及電子和光電元件及系統的熱管理。Fan-out/fan-in WLP、MEMS、LED、CIS、TSV、3D IC 整合、異質整合/SiP 和 SMT。無鉛焊接、製造及焊點可靠性。
[2] 管理研發團隊，開發半導體先進封裝的新技術和實用技術。
[3] 向高層管理提供先進封裝的最新進展和趨勢，並為年輕工程師和經理提供指導。
出版超過 22 本書（均為第一作者），517 篇經過同行評審的論文（其中 375 篇為主要研究者），40 項已授權及待授權的美國專利（其中 25 項為主要發明人），以及 325 場主題演講/講座。

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