Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: Epits 2022, 14-15 September, Langkawi, Malaysia

Mohd Salleh, Mohd Arif Anuar, Che Halin, Dewi Suriyani, Abdul Razak, Kamrosni

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: Epits 2022, 14-15 September, Langkawi, Malaysia
  • 出版商: Springer
  • 出版日期: 2024-07-04
  • 售價: $4,690
  • 貴賓價: 9.5 折 $4,456
  • 語言: 英文
  • 頁數: 875
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 981199269X
  • ISBN-13: 9789811992698

    • 海外代購書籍(需單獨結帳)

相關主題

商品描述

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies, (3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

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商品描述(中文翻譯)

本書呈現了來自綠色材料與電子封裝互連技術研討會（EPITS 2022）的同行評審文章，該研討會於2022年9月14日和15日在馬來西亞的蘭卡威舉行。此次會議匯聚了封裝專家，共同分享和交流電子技術的想法。本卷涵蓋的主題包括但不限於：(1) 綠色材料與技術，(2) 新興的互連材料與技術，(3) 芯片和封裝層級的非焊接互連材料，(4) 電子封裝材料的基本材料行為，(5) 應用於電子封裝技術的先進表徵方法，(6) 汽車和電力電子用高溫無鉛焊料及相關互連的發展，(7) 表面塗層材料，以及 (8) 先進材料。

作者簡介

​Dr. Mohd Arif Anuar Mohd Salleh is an Associate Professor under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. He graduated with B.Eng honours in Mechanical Engineering (2006) followed by M.Eng in Mechanical Engineering majoring in Materials (2007) from the Universiti Tun Hussein Onn Malaysia. He received his PhD in 2016 from the University of Queensland, Australia in the field of Materials Engineering specifically in the development of advance solder materials. He is currently the President of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. He has experience working and lecturing in the electronic packaging materials field for more than 13 years. He also worked as part time research officer for a few research projects on solder materials development at the University of Queensland Australia (2013-2015) and at Imperial College London (2015).

Dr. Dewi Suriyani Che Halin is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng honours in Mineral Resources Engineering (2004) and Masters in Science (M. Sc.) in Materials Engineering (2005) from Universiti Sains Malaysia. She received her PhD in 2009 from Universiti Kebangsaan Malaysia in the field of Materials Science specifically in the semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in the surface engineering and electronic packaging materials field for more than 11 years.

Dr. Kamrosni Abdul Razak is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng with honours in Mechanical Engineering (2004) from Universiti Kebangsaan Malaysia. She received her Master in Science (M. Sc.) in Materials Engineering (2012) and PhD in 2020 from Universiti Malaysia in the field of Materials Science specifically in semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in materials field for more than 11 years.

Dr. Mohd Izrul Izwan Ramli obtained his PhD from the Universiti Malaysia Perlis (UniMAP) Malaysia, in materials engineering. Currently he works as a Postdoctoral researcher at Universiti Malaysia Perlis (UniMAP). His research interests are in the areas of materials engineering, focusing on the development of lead-free solder alloys for electric/electronic interconnects. His research activities includeusing advance material characterizations technique such as synchrotron imaging, synchrotron XRF and synchrotron tomography and have contributed to several leading discoveries in solder alloy development.

作者簡介(中文翻譯)

Dr. Mohd Arif Anuar Mohd Salleh 是馬來西亞玻璃大學化學工程技術學院材料工程課程的副教授。他於2006年獲得機械工程榮譽學士學位，並於2007年在馬來西亞敦胡先翁大學獲得材料專業的機械工程碩士學位。他於2016年在澳洲昆士蘭大學獲得材料工程領域的博士學位，專注於先進焊料材料的開發。目前，他是馬來西亞錫焊料技術研究的主席，隸屬於馬來西亞錫業委員會（研究與發展）。他在電子封裝材料領域擁有超過13年的工作和教學經驗。他還曾在2013年至2015年間擔任昆士蘭大學和2015年在倫敦帝國學院的焊料材料開發研究項目的兼職研究員。

Dr. Dewi Suriyani Che Halin 是馬來西亞玻璃大學化學工程技術學院材料工程課程的高級講師。她於2004年獲得礦產資源工程榮譽學士學位，並於2005年在馬來西亞科學大學獲得材料工程的科學碩士學位。她於2009年在馬來西亞國立大學獲得材料科學領域的博士學位，專注於半導體材料。目前，她是馬來西亞錫焊料技術研究的成員，隸屬於馬來西亞錫業委員會（研究與發展）。她在表面工程和電子封裝材料領域擁有超過11年的工作和教學經驗。

Dr. Kamrosni Abdul Razak 是馬來西亞玻璃大學化學工程技術學院材料工程課程的高級講師。她於2004年在馬來西亞國立大學獲得機械工程榮譽學士學位。她於2012年獲得材料工程的科學碩士學位，並於2020年在馬來西亞獲得材料科學領域的博士學位，專注於半導體材料。目前，她是馬來西亞錫焊料技術研究的成員，隸屬於馬來西亞錫業委員會（研究與發展）。她在材料領域擁有超過11年的工作和教學經驗。

Dr. Mohd Izrul Izwan Ramli 獲得了馬來西亞玻璃大學（UniMAP）的材料工程博士學位。目前，他在馬來西亞玻璃大學（UniMAP）擔任博士後研究員。他的研究興趣集中在材料工程領域，專注於無鉛焊料合金的開發，用於電氣/電子互連。他的研究活動包括使用先進的材料表徵技術，如同步輻射成像、同步輻射XRF和同步輻射斷層掃描，並對焊料合金的開發做出了幾項重要的貢獻。

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