基於多層LCP基板的高密度系統集成技術

第 1 章 LCP 材料簡介及制備工藝 ··············································································1
1.1 LCP 材料的發展歷史 ···················································································.1
1.2 LCP 材料的基本特性 ···················································································.4
1.3 LCP 材料的應用 ·························································································.6
1.4 單層 LCP 基板制備工藝 ·············································································.10
1.5 多層 LCP 基板制備工藝 ·············································································.13
1.6 多層 LCP 基板關鍵工藝技術 ·······································································.17
1.7 本章總結 ································································································.22
1.8 參考文獻 ································································································.22
第 2 章 多層 LCP 電路板中過孔互連結構的研究 ························································24.
2.1 多層 LCP 電路板建模方法的研究 ·································································.24
2.1.1 多層 LCP 電路板建模方法的研究與發展現狀 ··············································.24
2.1.2 帶有過孔的多層 LCP 電路板建模流程 ·······················································.28
2.2 CPWG-SL-CPWG 過孔互連結構的設計與實現 ················································.30
2.2.1 過孔互連結構的基本模型 ······································································.31
2.2.2 過孔互連結構的模擬設計 ······································································.33
2.2.3 過孔互連結構的匹配優化 ······································································.36
2.2.4 過孔互連結構的表徵與測試 ···································································.41
2.3 CPWG-SL-CPWG 過孔互連結構的快速收斂等效電路模型 ·································.42
2.3.1 典型的П型等效電路模型 ······································································.43
2.3.2 П型等效電路模型寄生參數提取 ······························································.44
2.3.3 過孔互連結構的快速收斂等效電路模型的構建 ············································.49
2.3.4 等效電路模型的模擬驗證 ······································································.51
2.4 CPWG-SL-CPWG 過孔互連結構的高精度等效電路模型 ····································.53
2.4.1 電源／接地面對過孔傳輸特性的影響 ························································.54
2.4.2 典型過孔的內在等效電路模型·································································.57
2.4.3 內在等效電路模型的參數提取·································································.59
2.4.4 過孔互連結構的高精度等效電路模型的構建 ···············································.61
2.4.5 等效電路模型的模擬驗證 ······································································.62
2.5 本章總結 ································································································.65
2.6 參考文獻 ································································································.66
第 3 章 毫米波射頻前端系統中鍵合線電路的分析與設計 ·············································.70
3.1 鍵合線材料的分析 ····················································································.71
3.2 引線鍵合技術的簡介 ·················································································.72
3.3 鍵合線等效電路模型的構建 ········································································.74
3.3.1 鍵合線幾何長度的提取 ·········································································.74
3.3.2 鍵合線寄生參數的提取 ·········································································.77
3.3.3 雙線鍵合的等效電路模型 ······································································.79
3.3.4 鍵合線結構參數對其傳輸特性的影響 ························································.80
3.4 Ka 波段鍵合線匹配電路的設計與實現 ··························································.87
3.4.1 基於微帶線的單線鍵合匹配電路 ······························································.87
3.4.2 基於微帶線的雙線鍵合匹配電路 ······························································.94
3.5 W 波段鍵合線匹配電路的設計與實現 ···························································.99
3.5.1 基於 CPWG 的雙線鍵合匹配電路 ···························································.100
3.5.2 基於 CPWG 的單線鍵合匹配電路 ···························································.107
3.6 基於 LCP 基板的鍵合線匹配電路的設計流程 ·················································.112
3.7 本章總結 ·······························································································.113
3.8 參考文獻 ·······························································································.114
第 4 章 微帶線-微帶線槽線耦合過渡結構 ································································.116
4.1 微帶線-微帶線槽線耦合過渡結構的基本特性 ················································.116
4.1.1 微帶線-微帶線槽線耦合過渡結構的提出 ··················································.116
4.1.2 微帶線-微帶線槽線多模諧振器的基本結構 ···············································.117
4.1.3 微帶線-微帶線槽線多模諧振器的工作原理 ···············································.117
4.1.4 微帶線-微帶線槽線耦合過渡結構等效電路模型分析 ···································.118
4.2 T 型枝節線槽線耦合過渡結構 ····································································.120
4.2.1 T 型枝節線槽線耦合過渡結構等效電路分析 ··············································.120
4.2.2 均勻雙槽線耦合過渡結構的設計 ·····························································.122
4.2.3 T 型枝節線槽線耦合過渡結構的設計 ·······················································.128
4.2.4 T 型枝節線槽線耦合過渡結構的製作工藝 ·················································.132
4.2.5 T 型枝節線槽線耦合過渡結構的表徵與測試 ··············································.133
4.3 微帶枝節加載槽線耦合過渡結構 ·································································.135
4.3.1 微帶枝節加載槽線諧振器的提出 ·····························································.135
4.3.2 微帶枝節加載槽線耦合過渡結構的設計 ····················································.136
4.3.3 微帶枝節加載槽線耦合過渡結構的表徵與測試 ···········································.146
4.4 環形諧振器槽線耦合過渡結構 ····································································.149
4.4.1 環形諧振器均勻雙槽線耦合過渡結構的設計 ··············································.149
4.4.2 環形諧振器背對背 Y 型槽線耦合過渡結構的設計 ·······································.150
4.4.3 環形諧振器 H 型槽線耦合過渡結構的設計 ················································.153
4.4.4 環形諧振器槽線耦合過渡結構的表徵與測試 ··············································.155
4.5 本章總結 ·······························································································.158
4.6 參考文獻 ·······························································································.159
第 5 章 基於 LCP 無源器件的設計與研究 ·······························································.161
5.1 LCP 無源電感的概述 ················································································.161
5.2 LCP 集總參數電感性能的研究 ····································································.164
5.2.1 水平螺旋電感性能的研究 ·····································································.164
5.2.2 平面螺旋電感性能的研究 ·····································································.169
5.2.3 8-shaped 型電感性能的研究 ···································································.175
5.3 LCP 分佈式電感性能的研究 ·······································································.178
5.4 垂直叉指電容的概述 ················································································.180
5.5 垂直叉指電容性能的研究 ··········································································.181
5.5.1 電容 型等效電路模型的分析 ·································································.181
5.5.2 二埠電容結構參數的分析 ··································································.183
5.5.3 單埠電容結構參數的分析 ··································································.187
5.6 垂直叉指電容的優化設計 ··········································································.189
5.6.1 帶有 DGS 的二埠正方形垂直叉指電容 ··················································.190
5.6.2 帶有 DGS 的單埠正方形垂直叉指電容 ··················································.191
5.7 UHF 濾波器設計的概述 ············································································.195
5.8 UHF 集總參數低通濾波器的設計 ································································.197
5.8.1 低通濾波器電路與參數的分析································································.197
5.8.2 低通濾波器的模擬設計 ········································································.198
5.8.3 低通濾波器的實物測試 ········································································.200
5.9 UHF 集總參數帶通濾波器的設計 ································································.202
5.9.1 帶通濾波器的模擬設計 ········································································.202
5.9.2 帶通濾波器的實物測試 ········································································.205
5.10 UHF 半集總參數雙通帶通濾波器的設計 ·····················································.207
5.10.1 半集總濾波器電路與參數分析 ······························································.207
5.10.2 半集總濾波器的模擬設計 ····································································.210
5.10.3 半集總濾波器的實物測試 ····································································.212
5.11 本章總結 ·····························································································.214
5.12 參考文獻 ·····························································································.215