無線秘籍 — 射頻電路設計入門

李明，擁有豐富的產品研發經驗，先後參與研發惠普（HP）掌上電腦（Windows Mobile PDA）、中國聯通WCDMA Mi-Fi、智能手機、京東智能路由器等無線通信產品。
現任科大訊飛消費者事業群智能終端部硬件產品總監；成都某高校外聘教師，教授通信工程、電子工程等相關專業的實戰課程。

第1章 無線通信的起源和發展歷程........................................ ...................... 1
1.1 無線通信的起源............................................. ................................ 2
1.2 無線通信當今的發展............................................ .......................... 6
1.3 無線通信行業蓬勃發展的趨勢.......................................... .............. 8

第2章 無線通信的基本概念.......................................... ............................. 10
2.1 工作頻段（Operating Band）........................................... ............. 11
2.2 通道（Channel）............................................. ............................. 12
2.3 多址（Multiple Access）方式.......................................... .............. 14
2.4 雙工（Duplex）方式........................................... ......................... 17
2.5 調製（Modulation）方式............................................ .................. 18
2.6 分集（Diversity）............................................. ............................ 21
2.7 多輸入多輸出（MIMO）.......................................... .................... 22

第3章 什麼是射頻和射頻系統基本架構....................................... .............. 25
3.1 什麼是射頻.............................................. .................................... 26
3.2 射頻系統架構.............................................. ................................. 30

第4章 射頻發射機系統架構.......................................... ............................. 40
4.1 兩次變頻發射機............................................ ............................... 41
4.2 直接變頻發射機............................................. .............................. 46
4.3 發射機的性能指標............................................ ............................ 52
4.4 常用單位介紹.............................................. ................................. 69

第5章 射頻接收機系統架構.......................................... ............................. 74
5.1 超外差一次變頻接收機.......................................... ....................... 75
5.2 超外差二次變頻接收機......................................... ........................ 77
5.3 直接變頻接收機............................................. .............................. 81
5.4 接收機的射頻指標............................................ ............................ 85

第6章 射頻單元電路............................................ ..................................... 99
6.1 射頻收發芯片（RF Transceiver）.......................................... ...... 101
6.2 功率放大器（PA）............................................ ......................... 112
6.3 低噪聲放大器（LNA）........................................... .................... 122
6.4 射頻前端模塊（FEM）........................................... .................... 128
6.5 有源晶振和無源晶振.......................................... ........................ 132
6.6 射頻開關（Switch）............................................ ....................... 138
6.7 雙工器（Duplexer）........................................... ........................ 143
6.8 射頻濾波器（Filter）........................................... ....................... 148
6.9 功率耦合器（Coupler）........................................... ................... 153
6.10 雙訊器（Diplexer）........................................... ........................ 156
6.11 電阻、電容和電感............................................ ........................ 159
6.12 天線（Antenna）............................................. ......................... 163

第7章 與阻抗相關的基礎知識......................................... ......................... 172
7.1 阻抗和阻抗匹配............................................. ............................ 173
7.2 阻抗線............................................... ........................................ 178
7.3 史密斯圓圖.............................................. .................................. 185

第8章 工程實戰基礎與技能.......................................... ........................... 196
8.1 無線通信協議.............................................. ............................... 199
8.2 電路原理圖.............................................. .................................. 206
8.3 印製電路板（PCB）.......................................... ......................... 212
8.4 焊接和調試.............................................. .................................. 218
8.5 射頻校準............................................... ..................................... 222
8.6 射頻測試儀器.............................................. ............................... 225
8.7 產品認證............................................... ..................................... 231

參考文獻................................................ .................................................. . 238

後記................................................. .................................................. ....... 239