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商品描述
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.
It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
商品描述(中文翻譯)
這本涵蓋新興但非常重要領域的綜合性著作，將經典2D電子學的已知物理限制與進一步電子發展的需求及市場必要性進行了對比。這本兩卷本的手冊提出了針對特徵密度問題的3D解決方案，涵蓋了所有重要議題，如晶圓處理、晶片黏合、封裝技術及熱方面的考量。
手冊以引言部分開始，定義了必要的目標、現有的問題，並將3D整合與行業的半導體路線圖相關聯。接著詳細介紹了處理技術和3D結構製造策略。隨後探討了應用領域及3D整合的未來展望。
這些貢獻來自於該領域的關鍵參與者，包括學術界和產業界的專家，涉及的公司有林肯實驗室（Lincoln Labs）、弗勞恩霍夫（Fraunhofer）、RPI、ASET、IMEC、CEA-LETI、IBM和瑞薩（Renesas）等。
