Through Silicon Vias
暫譯: 通過矽通孔

Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam

Through Silicon Vias
  • 出版商: CRC
  • 出版日期: 2016-08-26
  • 售價: $8,640
  • 貴賓價: 9.5 折 $8,208
  • 語言: 英文
  • 頁數: 232
  • 裝訂: Hardcover
  • ISBN: 1498745520
  • ISBN-13: 9781498745529

    • 海外代購書籍(需單獨結帳)

相關主題

商品描述

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

商品描述(中文翻譯)

最近在半導體技術方面的進展提供了垂直互連通道（via），這些通道穿過矽，通常稱為通過矽通道（through silicon via, TSV）。本書對TSV背後的理論進行了全面的回顧，同時涵蓋了材料、模型和設計方面的最新進展。此外，根據幾何形狀和物理配置，還介紹了基於銅（Cu）、碳納米管（carbon nanotube, CNT）和石墨烯納米帶（graphene nanoribbon, GNR）的不同電氣等效模型。基於這些電氣等效模型，還討論了Cu、CNT和GNR基於TSV的性能比較。

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