Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Wei, Xing-Chang

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

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商品描述

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

 

 

商品描述(中文翻譯)

「高速印刷電路板和封裝的電磁相容性建模與設計」介紹了與高速印刷電路板（PCB）和電子封裝相關的三個主要電磁相容性（EMC）問題的電磁建模和設計：信號完整性（SI）、電源完整性（PI）和電磁干擾（EMI）。重點放在PCB和封裝的兩個基本被動元件上：電源分佈網絡和信號分佈網絡。本書分為兩部分。第一部分介紹了用於EMC建模的場-電路混合方法，包括模態方法、積分方程方法、柱狀波展開方法和去嵌入方法。第二部分介紹了EMC設計方法，並探討了新型超材料和二維材料在傳統EMC問題上的應用。

本書旨在加強實用工程師的有價值的電磁理論和數學方法，並培養具有先進EMC應用的學生。

（以上為純文字翻譯，已移除HTML代碼）

作者簡介

 

 

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.

 

 

 

 

 

 

 

 

 

His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.

 

 

作者簡介(中文翻譯)

邢昌健博士於2001年從中國西安電子科技大學獲得電氣工程博士學位。從2001年到2010年，他在新加坡A*STAR高性能計算研究所擔任研究員、高級研究工程師和研究科學家。他因對新穎電磁兼容性（EMC）測量設施的開發做出的貢獻，於2007年獲得新加坡工程師學會的傑出工程成就獎。2010年，他加入中國杭州的浙江大學擔任教授，並獲得中國教育部的新世紀優秀人才獎。

他的主要研究方向包括高速印刷電路板的電源完整性和信號完整性模擬與設計，通過中間連接器孔分析以及計算電磁學的快速算法的開發。他在高速印刷電路板和封裝的EMC建模和設計方面擁有超過10年的研究經驗。他在這個領域發表了50多篇論文，發表在IEEE Transactions和IEEE國際會議上。

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